From sawing semiconductor and photovoltaic wafers using diamond wire to machining structural parts for EUV lithography and vacuum components for plasma chambers up to quartz processing – as diverse as the electronics industry is, as individual are the solutions.
Discover the special challenges of diamond wire cutting
We help you understand the complex requirements of diamond wire cutting/sawing (DWS). DWS is mainly used to cut thin workpieces made of hard and brittle materials, such as silicon wafers for photovoltaic modules or substrates for LEDs.
In this application, a thin wire is wound around so-called wire guide rollers and set in a forward/reverse motion. Like in an oversized egg cutter, the material is then pressed through this wire field and cut by abrasive particles (diamonds) that are firmly attached to the wire. This allows for significantly faster processing speeds than in the so-called slurry process.
Wire tension
A big challenge in DWS is the thin wire, often thinner than a human hair. This means that it can only be wound onto the guide rollers with very low tension.
It is therefore crucial that the right cutting fluid gets used. The wrong fluid can cause variations in total workpiece thickness (TTV) or even wire breaks.
Dirt load
DWS processes are often run in batch mode. This means that the cutting fluid is used for one cut and doesn’t get filtered (there are exceptions with centrifuges, sedimentation and filtration).
Without filtration, a lot of dirt is to be expected, amounting to half the mass of the workpiece. This can affect the quality of the cut, e.g. by causing TTV, saw marks or chipping.
Whether silicon, sapphire, neodymium magnets, silicon carbide, or germanium, we know the specific requirements for the cutting fluid. As pioneer in DWS technology, we have vast experience with a wide variety of materials and processes and therefore know that small differences in the fluid formulation can make all the difference.
We see ourselves as link between chemistry and mechanics. We understand the requirements of both OEM and machining and can therefore offer solutions that we’ve specifically developed for the electronics industry, minimizing risks and ensuring stable production processes.
Wire tension
By specifically controlling the properties of our DWS fluids, we can minimize negative influences even on the thinnest wires.
This begins with the optimization of the surface tension of the fluid and ends with preventing any agglomeration of dirt in the grooves of the wire guide rollers.
Dirt load
Our DWS fluids are designed for maximum flushing performance of the diamond wires, ensuring high and stable cutting performance and preventing the wires from breaking through the workpiece surface at the end of the cut.
Depending on material, fluid requirements differ to keep particles in the right suspension or to influence the sedimentation behavior.
Benefit from our knowledge and experience in the electronics industry in general and in DWS in particular. Our experienced team of machining experts and chemists will always find the right solution for you.